Presentation of the Virtex® Ultrascale+™ VU9PI FPGA PCIe board


Product overview

The XpressVUP-LP9PTI Virtex® Ultrascale+™ VU9P FPGA board is using the low-profile PCIe network processing FPGA board combined with a conduction cooled heat spreader.

The XpressVUP-LP9PTI board is based on a AMD Virtex® Ultrascale+™ VU9P FPGA. The device provides the highest performance and integration capabilities in a 14 nm/16 nm FinFET node.
The board provides 2 banks of DDR4, 2 banks of QDR2+ memories, and two QSFP28 cages for multi 10 GbE/40 GbE/100 GbE networking solutions.
This FPGA board comes mounted on a conduction-cooled heat spreader, with an acrylic coating, and is specially designed for fanless industrial and rugged defense system applications.

If you are looking for a standard single-slot PCIe board, with a passive heatsink, check the XpressVUP-LP5/9P Virtex® Ultrascale+™ VU5P/VU9P FPGA PCIe board.
If you are looking for more processing performances, with an active dual-slot heatsink, check the XpressVUP-LP9PT3 Virtex® Ultrascale+™ VU9P-3 FPGA PCIe board.

Benefits & features


  • Conduction cooled heat spreader, equipped with a low-profile PCIe Virtex Ultrascale+ VU9P FPGA board
  • Acrylic coating, Industrial temp grade
  • PCIe Gen3 x16 interface
  • 2 banks of DDR4, 16GByte total
  • 2 banks of QDR2+, 576 Mbit total
  • Two QSFP28 optical cage for multi networking solutions


The XpressVUP-LP9P Virtex® Ultrascale+™ VU9P FPGA PCIe board is a low-profile FPGA board, compliant with RoHS/REACH, ISO 9001 and UL standards.

This board is based on the AMD Virtex® Ultrascale+™ VU9P FPGA semiconductor, which offers a large capacity of logic elements and storage memory.

Our Virtex® Ultrascale+™ VU9P FPGA PCIe board offers primary interfaces and components, such as PCB and circuitry, 100 GB ethernet, PCI-Express slot, DDR4 and QDR2+ memories, JTAG connector, transceivers, clock, power supply, power connector, and more (see Specifications tab).

The PCI Express (Peripheral Component Interconnect Express) standard is an expansion bus used for exchanges between expansion boards and a computer's motherboard. Our FPGA board offers a x16 PCIe slot, which, combined with the AMD Virtex® Ultrascale+™ VU9P FPGA, makes it faster and more efficient.

Accelerate your future embedded project to market with our Virtex® Ultrascale+™ VU9P board, thanks to optimized FPGA programming. We leverage our firmware, hardware and software skills, as well as our comprehensive documentation, available schematics and reference designs to design our boards. This evaluation board enables rapid prototyping, guaranteeing reduced time-to-market.

The board is supplied mounted on a conduction-cooled, acrylic-coated heatsink. This heatsink has been designed to withstand industrial temperature classes from -40°C to +70°C, and is perfectly adapted to the conditions of defense applications.

Our Virtex® Ultrascale+™ VU9PI FPGA development board is specially designed for customer needs and specifications.
Our sales team is available to advise you on the best solution according to your needs, at sales@reflexces.com.


Block diagram of the Virtex® Ultrascale+™ VU9P FPGA PCIe board:

Tech specs

FPGA and configuration modules

  • AMD Virtex UltraScale+ 16nm FPGA : XCVU9P-2FLGB2104I
  • 2,6 M System Logic Cells, 270 Mb UltraRAM
  • JTAG connector for external AMD USB cable
  • 2x Nor Flash for dual quad SPI (x8) configuration mode

Communication Interfaces

  • PCI Express x16 (Gen 1, 2 or 3)
  • 2 x QSFP28 quad optical cage (2 x 4 XCVR : 28 Gb/s per link)
    • 10 GbE/25GbE/50GbE/100GbE/2 x 100GbE networking interface
  • Other protocols supported by the QSFP28 modules


  • On board DDR4, 2x banks by 64 bits + 8 bits ECC, total 16GB
  • On board QDR2+, 2x banks by 18 bits, total 576Mbits


  • Max 120W

Other resources

  • On board programmable PLL oscillator (Si5345), highly flexible and configurable clock generator.


  • Operating range : -40°C to 70°C
  • Industrial temp grade Bill of Material components
  • Conduction cooled up to 70°C onto the heat spreader

Mechanical dimensions (board + heat spreader)

  • Length : 215.70mm
  • Height : 93.83mm
  • Thickness : 24.9mm

Standards and compliance

  • Acrylic coating
  • RoHS/REACH compliant
  • UL certified
  • ISO9001 Facility



Board content

  • PCIe board equiped with conduction cooled heatsink
  • PCIe AUX power cable adaptor
  • JTAG adaptor cable to USB
  • XpressVUP Board Support Package
    • Reference Manual
    • HDL designs, Vivado 2023.1
    • PCIe Reference Design using AMD Xilinx QDMA IP
  •  Mechanical files: 3D DWF/STEP models and 2D CAD drawing (upon request)

Ordering information

XpressVUP-LP9PI : VU9P speed grade -2; 2 bank DDR4 by 72bit of 16GBytes total @2666MT/s; 2 banks QDR2+ by 18bit of 288Mbit each @550Mhz, Indus temp grade, conduction cooled heat spreader

Export control ECCN

ECCN Number : 4A994i

CECC (commodity Export Classification Certificate) : Download certificate

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