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Modified-COTS, or MOTS, is a modification made to a standard REFLEX CES COTS board, adapted to meet your specific requirements. Some MOTS can be created with a cost reduction objective. The modifications can include, for example, adding interfaces, depopulating the board, reducing the density of FPGA, finding workaround, and more.

For a lot of markets, the technologies are not supporting the whole lifetime of the project, and customers need to migrate their board from old to newest technologies for sensitive devices like FPGA, memories, PCB and others. Therefore, REFLEX CES can re-spin the board using long lifetime components and materials, potentially adding new features.

Memory is one of the shortest lifecycle components. REFLEX CES has the capacity to offer alternatives on memory components, for MOTS products, based on the expertise of the board engineerings teams.

MOTS_EOL

This example below shows anevolution of technology (from a MOTS based on an Intel® Stratix® IV FPGA to a COTS based on an Intel® Arria® 10 FPGA), and so an evolution of performances, but with the same objectives between the 2 projects.

Highlights:

  • PCIe Gen2 x8 -> PCIe Gen3 x8
  • Intel® Stratix® IV GX -> Intel® Arria® 10 GX
  • 10G Ethernet -> 80G Ethernet

Power dissipation and integration are rising topics with the growing thermal challenges of high-end FPGAs and larger bill of material for surrounding components (power tree, memory devices, optical cages, etc.). Latest FPGA generations have more than doubled power dissipation, with all the programmable logic available, numerous high-speed transceivers at 28Gbps or more, and exploding number of IO pins.

Additionally, customers are trying to use more FPGA boards in their systems. The integration becomes a challenge knowing that many systems are not optimized for PCIe FPGA boards (airflow direction, airflow guides, fan specification, cavities, etc.).

REFLEX CES can work with you to determine if the generic board heatsink is sufficient for your project usage, or if a specific custom heatsink needs to be developed (passive or active cooling) based on thermal simulations. We also help you to include in your project the type of server used, which depends on its configuration (PCIe slot, riser option, CPU configuration, etc.).

REFLEX CES is using off-The-Shelves servers that potentially we can modify, but also has the capabilities to design a full turnkey system for your dedicated embedded application.

MOTS_heatsink

This example shows the evolution of a COTS off-the-shelf board, the Stratix 10 200G PCIe board, to a MOTS board with a 2-slots passive dissipation.The goal for the customer was to reduce the air flow while keeping the same performances.

Highlights:

  • 1-slot passive dissipation -> 2-slots passive dissipation
  • Based on the Stratix® 10 200G PCIe board
MOTS_heatsink

This example shows the evolution of a COTS off-the-shelf board, The Stratix® 10 GX 80G PCIe board, with a 1-slot passive heatsink, to a MOTS board with a 2-slots active heatsink. The goal for the customer was to increase the thermal transfer by creating a bigger air flow around the heatsink.

Highlights:

  • 1-slot -> 2-slots
  • passive dissipation -> active dissipation
  • Based on the Stratix® 10 GX 800G PCIe board

A major and potentially critical part of the design is the connectivity with the signal integrity of the high-speed transceivers. One of the key skills of REFLEX CES is to assess how we can modify some of these connectivity parts of the design in order to fulfill the project needs, with the smallest impact on the overall design and its development cycle, and securing the changes. It can be by modifying the connectivity at the PCIe bracket, like optical cages or FMC connector at the front end of the board, by adding some specific extension connectors (GPIO, transceivers) for board-to-board communication, or by adding storage capabilities or video inputs/outputs, for example.

MOTS_connectivity

This example shows the connectivity customization of a COTS board. One of the optical cages has been deleted, to add monitoring and programming interfaces on the top face.

Highlights:

  • PCIe Gen3 x8
  • Intel® Arria® 10 GX 1150 KLE board
  • 4 GB DDR4 -> 8GB DDR4
  • Dual QSFP+ cages > 1 QSFP+ cage

Some vertical applications may have very specific requirements in terms of clocking / PLL speed and accuracy, connectors suitable to given standards, FPGA speed grade for the core or the transceivers, temperature range, or qualification process. We can study how to use our board and modify it in order to fit your specific requirements and conditions.

MOTS_specificperf

Intel®Stratix® 10 FPGA

Thanks to a reliable network of partners (for PCB, SMT, Mechanical, Plastics), and internal processes for quality control, integration and follow-up, REFLEX CES can handle and is sized forthe production of electronic boards and systems. As proof, REFLEX CES has a production capacity of 40 000 boards per year.

REFLEX CES relies on a strong EMS (Electronics Manufacturing Services) network.

REFLEX CES is able to manage your project during all phases: product development, system integration, manufacturing and assembly, PCB design and layout, model shop rapid prototyping.

REFLEX CES and its subcontractors are respecting IPC 610 and IPC 600, regulatory standards in electronic.

Prototyping

The prototyping activity is the action of creating and testing samples, before replicating it in the industrialization and production phases

In REFLEX CES, a unique research & development team internally manages the entire prototyping activity, from conception to final technical validation, including interaction with customers.

REFLEX CES takes care of the complete turnkey production and assembly services:

  • Development of inhouse test bench for prototypes, individually designed for each project
  • Printed circuit boards (including Surface Mount, Through Hole, RF communication, and backplane pressfit)
  • Subcontractors highly specialized in complex HDI PCB
  • Mechanical assemblies
  • Box build
  • Cable and hardness assemblies
  • Integrated purchasing department, to take off the risks during procurement phases

New Product Introduction (NPI) Process

The NPI process defines the stages required for a smooth transition from design to manufacturing:

  • Quick turn prototyping
  • Program transfer process
  • Resource planning
  • Design For Manufacturing (DFM) – for all new product builds

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