Ares SoM

Presentation of the Ares Agilex™ 7 FPGA SoC F-Series module

Ares SoM
Ares SoM

Product overview

The Ares SoM is an Agilex™ SoC F-Series system-on-module, based on the Intel® Agilex™ 7 FPGA SoC F-Series FPGA. The main advantage of the Agilex™ 7 SoC F-Series FPGA is its flexibility and high-performance capabilities, enabling designers to efficiently implement complex algorithms and integrate multiple functions onto a single chip, resulting in reduced power consumption, and improved system performance and technology.

The system-on-module (module SoM) is delivered with an active heatsink with heat spreader and fan, and is specifically optimized for embedded applications. Using a module for an embedded system can simplify the design process and reduce time-to-market by providing pre-built, tested components that can be easily integrated into your system.

Target markets of this Agilex™ SoC F-Series module include Bioscience, High Precision Measurement, Radar Systems, Electronic Warfare, Satellite Communication, and much more.

The Ares Agilex™ SoC F-Series module will be fully compatible its the carrier board (available soon).

Benefits & features

  • Intel® Agilex™ 7 FPGA SoC F-Series
  • AGF012
  • PCIe Gen4 x4 Root Complex
  • PCIe Gen4 x16 End Point
  • Quad-Core ARM Cortex A-53
  • 84x LVDS + 138 FPGA GPIOs
  • 32 transceivers @32Gbps NRZ OR up to 24 transceivers @58Gbps PAM4
  • Industrial Temp Grade
  • Long Term Supply
  • Designed for Bioscience, High Precision Measurement, Radar Systems, Electronic Warfare, Satellite Communication and "Customizable" markets


This module offers an Intel® Agilex™ 7 SoC F-Series FPGA technology.

Intel® Agilex™ F-Series devices are general-purpose FPGAs built on Intel 10 nm SuperFin process technology. The Intel® Agilex™ 7 SoC F-Series FPGA is part of the Agilex™ SoC family.


FPGAs (field programmable gate arrays) like Agilex™ SoC F-Series module and Agilex™ FPGA are used to offer high-capacity logic and memory storage.

Programmable logic and accelerator technologies such as Agilex™ FPGA chips can improve system performance while reducing power consumption. These accelerators can be programmed using embedded programming languages and integrated into the system design using industry-standard interfaces.

FPGA chips, including Agilex™ FPGA device, can be programmed using embedded programming languages such as VHDL or Verilog, and can be integrated into the system design using industry-standard interfaces such as PCI Express (PCIe = Peripheral Component Interconnect Express). They can be used to perform tasks such as image processing, data compression, and encryption more quickly and with less power consumption than a traditional processor.


The system-on-chip (SoC) is an integrated circuit inside the FPGA, most often a CPU (central processing unit) processor and supporting peripherals, that provides more flexibility and integration, and allows the FPGA to better control the board.


reflex ces included numerous essential components for an embedded board, developed for this intel agilex FPGA: PCB (Printed Circuit Board), transceivers, power supply, JTAG, DDR4, Flash eMMC memory, BMC (Baseboard Management Controller), and more.

Embedded programming is an essential part of developing embedded systems. Our designers carefully consider the architecture of the FPGA chip and the system design to ensure that the accelerator is correctly integrated into the system. They also consider the programming and debugging tools available for the FPGA chip, such as Intel Agilex™, to ensure efficient development and testing.


Reduce time to market of your next embedded project with our Agilex™ 7 FPGA SoC module, Agilex™ FPGA SoC board, using the Intel® Quartus Prime development tools. We draw on our firmware, hardware and software skills, and full documentation package and reference designs to create our boards.


The Intel® Agilex™ 7 FPGA SoC board is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) standard compliant.

Our designers always keep the industry standard and footprint in mind when developing embedded systems. Standard interfaces and architectures, ensure that the card and the system can be efficiently integrated into the larger ecosystem. The footprint of the system is also carefully considered, ensuring that it fits within the size constraints of the final product. With these considerations in mind, they create efficient and effective embedded systems that are ready to market.


Our Ares Agilex™ 7 FPGA SoC F-Series system-on-module, Intel Agilex™ FPGA device, and Agilex™ SoC is specially designed for customer needs. Our sales team is available to advise you on the best solution according to your needs and product specifications, at


Block diagram of the Ares Agilex™ 7 FPGA SoC F-Series module:

Tech specs

Features                                          Ares Agilex™ 7 FPGA SoC F-Series
FPGA SoC Agilex™ 7 FPGA SoC F-Series AGF012, AGFB012R24C2I2V, R24C package
1178 KLE, M20K 110Mbit, 3743 DSP Blocks
Quad Core Arm Cortex-A53 up to 1.43GHz
Transceiver speed grade 2, Core speed grade 2
Industrial Temp Grade
DDR4 Memory 3 banks DDR4, 24 GByte total HPS= 1 bank DDR4 x72bit bus, 8GByte, @2666MT/s
FPGA= 2 banks DDR4 x72bit bus, 8GByte each, @2666MT/s
Connectors Transceiver Mezzanine Connector 32 transceivers @32Gbps NRZ
OR up to 24 transceivers @58Gbps PAM4
(example: 16 transceivers @32Gbps NRZ + 16 @58Gbps PAM4)
IO Mezzanine Connector LVDS = 42 RX pairs and 42 TX pairs @1400Mbps
FPGA GPIOs = 138
HPS IO = depending used interfaces
FPGA Configuration 2Gbit Quad SPI Flash (store up to 2 images)
Software Configuration 128Gbyte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS)
+ SD Card support on the carrier board (RXCAGF-CBD0SA)
HPS Communication 1GbE RGMII, I2C, UART, USB 2.0 OTG, SPI slave and master, HPS IO
Mechanical & Environmental Specification Module rugged for shocks and high vibration
IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission),
EN60068 (Vibration: sinusoidal, 10Hz - 2KHz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g)
5-15V Power Input
Industrial temperature grade -40°C to +70°C (to be qualified)
Conformal coating (option on request)
Power & Dissipation Typ 113W, active airflow cooling (heat spreader + heatsink + fan)
fan noise < 50dB
Board Management Controller Communication with Carrier board: I2C, PWM, JTAG
Communication with FPGA : 1x UART to FPGA
Monitoring : Current, voltages, temperature, ID information
Programming : Clock
Control: Power, temperature protection, Fan
Module dimensions TBC: 107mm x 85mm (4.2 x 3.4 inches) / 12mm+ thickness (38.6mm with active heatsink and heat spreader) TBD
Deliverables • Ares module & its active heatsink system
• Board Support Package (to download from our online technical support) after purchase of a module and its carrier board:
Starter Guide, module and carrier board Reference Manuals, Interconnect pinout file
Mechanical drawings, assembly files
FPGA GHRD/GSRD Test Designs by interface (Quartus Prime Pro Edition 23.4)
BMC Software API
HPS Software:
-- Built with Yocto Project version 4.1 (langdale)
-- U-Boot bootloader (v2022.07), ATF Linux kernel (v5.15) and linux Poky distribution
• 1-year technical support and warrantee
• Online support at
Ordering Information RXCAGF012PR24-SOM00I
Availability: Samples Q2-2024
MOTS = Modified version on request R24C package compatible from 600KLE (AGF006) up to 2.7MLE (AGF027)
Contact sales for customization


Deliverables for the purchase of a System-on-Module:

  • Ares Agilex™ 7 FPGA SoC F-Series module
  • Active heatsink with heat spreader and fan


Ordering information: RXCAGF012PR24-SOM00I

Availability: Samples Q1-2024

Related products

Keep me informed

If you want to know more about reflex ces, sign up for our newsletter to be updated on our initiatives, sectorial news and upcoming events.