REFLEX CES is a 20-year-old design and manufacturing company for High-End FPGA boards and embedded systems. We are developing many projects with the latest technologies allowing quicker, safer, more cost-effective access to our customers in order to implement their projects and catch the product cycle and deployment on the market.
REFLEX CES offers a board design support from specification to validation, along with a strong experience of board design.
In order to validate the technical choices, simulations are done all along the board development:
Our goal, when talking about FPGA design, is to support our customers from the specification phase until the delivery of binary application files, through all the conception and validation stages.
With our in-depth FPGA knowledge, REFLEX CES helps you choose the device that perfectly meet your needs, from a constantly changing list of components from Intel® (with Agilex, Stratix, Arria, Cyclone, Max) and Xilinx® (Zynq UltraScale+, VirtexUltraScale+, Virtex-7, Kintex, Zynq, Artix).
Let REFLEX CES do the I/O planning of critical interfaces, such as memories (DDR3, DDR4, QDR-II+, QDR-IV…)and high-speed links (SFP, QSFP-28, QSFP-DD, PCI Express).
Paired with our board expertise, REFLEX CES guarantees a 100% operational hardware.
REFLEX CES will advise you about your architectural choices: internal or external RAM, existing IP or custom-made module, PCI Express, Ethernet, and more.
Our experience includes numerous projects spanningdiverse applications:
It is not only about coding. At REFLEX CES, we also master all the tools necessary for efficiency, fromboard architecture development to board validation:
Xilinx® UltraScale+® FPGA and Intel Stratix® 10® FPGA
Analog design focuses on signal fidelity, amplification and filtering. RF design focuses on the transmission of a signal between two circuits that have no direct electrical connection, using electromagnetic radiation.
We can wirelessly transfer analog and digital data by manipulating and interpreting these radiations.
REFLEX CES is an expert in those mixed signal applications:
The software experience of REFLEX CES includes a complete portfolio of software design expertise to satisfy specific customer requirements from embedded Board Support Package (BSP) to end-user applications:
REFLEX CES teams have expertise in development and optimization of all Board Support Package elements:
According to customer or project needs:
The main programming languages for our developments are:
Uses of various operating systems according to customer needs or selected by REFLEX CES:
Low Speed serial link:
Storage devices: EEPROM, NAND/NOR Flash, SATA, eMMC, Micro SD, NVMe/M.2
REFLEX CES develop heatsinks for the current and future needs of FPGAs (above 200W):
3D printings prototypes are also developed for tests (casing, retention parts, etc)
At REFLEX CES, mechanical skills also include the development of systems.
If our standard thermal solutions do not meet your needs, we candevelop custom thermal solutions. Our goal is to provide the optimal heat dissipation for the whole system. Thermal studies are conducted to ensure proper function.
Shock test: To ensure the product can withstand shock. The product is dropped at a 1.20m high on its 26 axes (sides, edges). This test is representative of a fall during the product transportation.
Examples of norms: AECTP 400, METHOD 414, PROCÉDURE 1 : TRANSIT DROP
Drop of a suitcase to test the durability
Vibration test : To ensure the product will work on a truck or boat, and that vibrations will not affect the product.
Examples of norms: JESD N°22B103B ; VITA47-Vibration V3 Choc OS2 MIL-STD-810F
Equipment position during the vibration test, to ensure vibrations do not affect the product
The tropicalization is the fact to adapt the product to the harsh environmental conditions
The MTBF indicator (mean time between failure) is a calculation of the predicted time between inherent failures of a hardware product. This measures the reliability of the product, and allows customer to make plans on the long-term.
Examples of norms:Guide FIDES 2009 édition A (Septembre 2010) / Telcordia SR-332 issue 3 standard
Thanks to a reliable network of partners (for PCB, SMT, Mechanical, Plastics), and internal processes for quality control, integration and follow-up, REFLEX CES can handle and is sized forthe production of electronic boards and systems. As proof, REFLEX CES has a production capacity of 40 000 boards per year.
REFLEX CES relies on a strong EMS (Electronics Manufacturing Services) network.
REFLEX CES is able to manage your project during all phases: product development, system integration, manufacturing and assembly, PCB design and layout, model shop rapid prototyping.
REFLEX CES and its subcontractors are respecting IPC 610 and IPC 600, regulatory standards in electronic.
The prototyping activity is the action of creating and testing samples, before replicating it in the industrialization and production phases
In REFLEX CES, a unique research & development team internally manages the entire prototyping activity, from conception to final technical validation, including interaction with customers.
REFLEX CES takes care of the complete turnkey production and assembly services:
The NPI process defines the stages required for a smooth transition from design to manufacturing:
Industrialization is when the prototype concept is optimized for cost-effective production and assembly.
REFLEX CES provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes, a full range of services and a strong and worldwide network of partners. From prototyping, low volume high mix to high volume global manufacturing, we provide industrialization services worldwide.
Thanks to a DFA (Design for Assembly) process, REFLEX CES is able to monitor the efficiency and lifetime of the boards, to better produce, and better support customers :
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