Contact
Support

REFLEX CES is a 20-year-old design and manufacturing company for High-End FPGA boards and embedded systems. We are developing many projects with the latest technologies allowing quicker, safer, more cost-effective access to our customers in order to implement their projects and catch the product cycle and deployment on the market.

REFLEX CES offers a board design support from specification to validation, along with a strong experience of board design.

High-end FPGA expertise, Intel® and Xilinx®

  • Configuration and clocks
  • Power supply
  • Memory (DDR3/4, QDRII+, QDRIV…)
  • High-speed links up to 32Gbits NRZ, 56 Gbits PAM4

Wide processors range

  • SoC Xilinx® (Zynq®) Intel® (Arria® and Stratix®) but also ARM-based (i.mX) or PowerPC-based (QorIQ) processors
  • 32bit µController expertise (STM32, Gecko, PIC32)

Various and diverse form factor knowledge

  • PCIe
  • COM Express
  • VPX
  • compactPCI
  • FMC
  • Modules

In-house CAD, using a strong experience of routing complex boards

  • 20+ layers
  • Flex-Rigid
  • HDI
  • µVia
  • VIPPO
  • Back-drilling
  • Fine pitch BGA (up to 0.4mm pitch)

Test runs

In order to validate the technical choices, simulations are done all along the board development:

  • Pre-layout simulations, to validate stackup and impedance
  • Post-layout SI (Signal integrity) simulations, to validate the speed links (Crosstalk, Eye diagrams)
  • Post-layout PI (Power integrity) simulations, to validate the DC drop and IC Power delivery networks

Our goal, when talking about FPGA design, is to support our customers from the specification phase until the delivery of binary application files, through all the conception and validation stages.

The right FPGA for your project:

With our in-depth FPGA knowledge, REFLEX CES helps you choose the device that perfectly meet your needs, from a constantly changing list of components from Intel® (with Agilex, Stratix, Arria, Cyclone, Max) and Xilinx® (VirtexUltraScale+, Virtex-7, Kintex, Zynq, Artix).

Let REFLEX CES do the I/O planning of critical interfaces, such as memories (DDR3, DDR4, QDR-II+, QDR-IV…)and high-speed links (SFP, QSFP-28, QSFP-DD, PCI Express).

Paired with our board expertise, REFLEX CES guarantees a 100% operational hardware.

Suitable skills for all of your needs:

REFLEX CES will advise you about your architectural choices: internal or external RAM, existing IP or custom-made module, PCI Express, Ethernet, and more.

Our experience includes numerous projects spanningdiverse applications:

  • High data rate routing, processing, store and replay (10/40/100Gb Ethernet, custom user data).
  • Ethernet/PCI Express/DDR4/HDMI/DisplayPort interfaces.
  • Full application, reference designs or simple IP to be integrated by the customer.
  • Test benches for the electrical validation of boards with high-speed interfaces (32Gbps NRZ and 56Gbps PAM-4 transceivers, DDR4, QDR-II+, PCI Express)
  • Possible pairing with ARM processors of Intel® SX and Xilinx® Zynq families.
  • ADC/DAC interfaces.
  • IA inference with standalone FPGA.

Full control of tools and components:

It is not only about coding. At REFLEX CES, we also master all the tools necessary for efficiency, fromboard architecture development to board validation:

  • Intel® Quartus, Xilinx®Vivado.
  • Early functional validation with simulation using Modelsim.
  • On-board transceiver qualification using on-die instrumentation tools such as Intel® “Transceiver Toolkit” and Xilinx® “IBERT”.
  • System debugging with Intel SignalTap, Xilinx® ILA and JTAG Avalon-MM/AXI master.
  • Specific IP, tools and flow: Partial Reconfiguration (PR) and CvP; dual boot from factory/user image; high-speed protocols: 100Gb Ethernet Intel® “Serial Lite” and Xilinx® “Aurora”; Gigabit Vision, and more.
IntelFPGA
XilinxFPGA

Xilinx® UltraScale+® FPGA and Intel Stratix® 10® FPGA

Analog design focuses on signal fidelity, amplification and filtering. RF design focuses on the transmission of a signal between two circuits that have no direct electrical connection, using electromagnetic radiation.

We can wirelessly transfer analog and digital data by manipulating and interpreting these radiations.

REFLEX CES is an expert in those mixed signal applications:

  • Implementation of the front-end analog channels (amplification, attenuation, filtering, etc), paired with FPGAs or processors
  • ISM radio bands implementation
  • High-end ADC/DAC adaptation
  • Electromagnetic compatibility (EMC) constraints

The software experience of REFLEX CES includes a complete portfolio of software design expertise to satisfy specific customer requirements from embedded Board Support Package (BSP) to end-user applications:

Processors, Microcontrollers and SoCs:

  • x86 based : Core i5/i7, Xeon®
  • PowerPC/QorIQ technologies
  • ST Micro Electronics® STM32
  • Microchip® PIC32
  • Intel® PSG SoCs (Arria® 10, Stratix® 10), Intel PSG Nios®II
  • Xilinx® ZYNQ 7000, UltraScale+ MPSoC

Board Support Package (BSP):

REFLEX CES teams have expertise in development and optimization of all Board Support Package elements:

  • Bootloader
  • Kernel
  • Filesystems: Linux rootfs based on Linaro, Buildroot, Yocto … or full custom OS
  • Drivers (Linux and Windows)
  • Libraries
  • Test applications and scripts

Large scope of End-User applications

According to customer or project needs:

  • Test application and scripts
  • Command line applications
  • Graphical User Interface (Generally based on Qt)
  • Web site
  • more

ProgrammingLanguages :

The main programming languages for our developments are:

  • C,
  • C++ (classical C++98 and modern C++11/C++14/C++17),
  • Script (python, shell, perl …),
  • Web languages (html5, php, javascript …)

Development tools :

  • Qt Creator,
  • Visual Studio Code,
  • Eclipse based IDE (XSDK/VITIS from Xilinx, System workbench for STM32…)

Software Frameworks:

  • Qt 5.X,
  • Node.JS / Vue.JS,
  • more

Operating Systems:

Uses of various operating systems according to customer needs or selected by REFLEX CES:

  • Linux
    • Debian and derivatives,
    • RPM (CentOS/Fedora) and derivatives
    • Full custom for specific needs and optimizations like size, boot/shutdown time, etc)
  • Windows 7/10,
  • FreeRTOS Operating System
  • more

Some of the main technologies and protocols expertise:

Low Speed serial link:

  • UART
  • I2C
  • SPI

Communication protocols:

  • GbE
  • PCIe
  • USB

Storage devices: EEPROM, NAND/NOR Flash, SATA, eMMC, Micro SD, NVMe/M.2

REFLEX CES develop heatsinks for the current and future needs of FPGAs (above 200W):

3D printings prototypes are also developed for tests (casing, retention parts, etc)

At REFLEX CES, mechanical skills also include the development of systems.

Click here for more information on our rugged, rack-mounted and customized systems.

Thermal

If our standard thermal solutions do not meet your needs, we candevelop custom thermal solutions. Our goal is to provide the optimal heat dissipation for the whole system. Thermal studies are conducted to ensure proper function.

Shock and vibration

Shock test: To ensure the product can withstand shock. The product is dropped at a 1.20m high on its 26 axes (sides, edges). This test is representative of a fall during the product transportation.

Examples of norms: AECTP 400, METHOD 414, PROCÉDURE 1 : TRANSIT DROP

Shock lab test

Drop of a suitcase to test the durability

Vibration test : To ensure the product will work on a truck or boat, and that vibrations will not affect the product.

Examples of norms: JESD N°22B103B ; VITA47-Vibration V3 Choc OS2 MIL-STD-810F

Vibration test

Equipment position during the vibration test, to ensure vibrations do not affect the product

Tropicalization

The tropicalization is the fact to adapt the product to the harsh environmental conditions

  • Climatic tests, for pressure, temperature, moisture : Examples of norms: Stanag 4370 AECTP230 Ed 3
  • Water and dusttightness : Examples of norms: IP65

MTBF

The MTBF indicator (mean time between failure) is a calculation of the predicted time between inherent failures of a hardware product. This measures the reliability of the product, and allows customer to make plans on the long-term.

Examples of norms:Guide FIDES 2009 édition A (Septembre 2010) / Telcordia SR-332 issue 3 standard

Thanks to a reliable network of partners (for PCB, SMT, Mechanical, Plastics), and internal processes for quality control, integration and follow-up, REFLEX CES can handle and is sized forthe production of electronic boards and systems. As proof, REFLEX CES has a production capacity of 40 000 boards per year.

REFLEX CES relies on a strong EMS (Electronics Manufacturing Services) network.

REFLEX CES is able to manage your project during all phases: product development, system integration, manufacturing and assembly, PCB design and layout, model shop rapid prototyping.

REFLEX CES and its subcontractors are respecting IPC 610 and IPC 600, regulatory standards in electronic.

Prototyping

The prototyping activity is the action of creating and testing samples, before replicating it in the industrialization and production phases

In REFLEX CES, a unique research & development team internally manages the entire prototyping activity, from conception to final technical validation, including interaction with customers.

REFLEX CES takes care of the complete turnkey production and assembly services:

  • Development of inhouse test bench for prototypes, individually designed for each project
  • Printed circuit boards (including Surface Mount, Through Hole, RF communication, and backplane pressfit)
  • Subcontractors highly specialized in complex HDI PCB
  • Mechanical assemblies
  • Box build
  • Cable and hardness assemblies
  • Integrated purchasing department, to take off the risks during procurement phases

New Product Introduction (NPI) Process

The NPI process defines the stages required for a smooth transition from design to manufacturing:

  • Quick turn prototyping
  • Program transfer process
  • Resource planning
  • Design For Manufacturing (DFM) – for all new product builds

Industrialization is when the prototype concept is optimized for cost-effective production and assembly.

REFLEX CES provides customers with 20 years of leadership and experience in advanced PCB Assembly technology, with proven processes, a full range of services and a strong and worldwide network of partners. From prototyping, low volume high mix to high volume global manufacturing, we provide industrialization services worldwide.

Development of an automatic test bench with several checking steps, and implementation of other tests:

  • X-rays
  • Environmental stress
  • Automatic Optic Inspection (AOI, inspection via camera)
  • Flying probe tests
  • Functional test bench: final test

Medium to volume services available with REFLEX CES to fulfill your production needs:

  • Complete ICT, X-RAY, Functional & RF Test Support
  • Full Turnkey Services, Centralized Supply Chain
  • Demand Management
  • BTO/Order Fulfillment
  • End Product Configuration and Distribution
  • Final Pack Out
  • Global Logistics
  • Warranty and Repair

Boards analysis and monitoring

Thanks to a DFA (Design for Assembly) process, REFLEX CES is able to monitor the efficiency and lifetime of the boards, to better produce, and better support customers :

  • Predictive obsolescence, PCN Product Change Notice (PCN),End-of-life (EOL) of the Bill of Material (BOM) with SiliconExpert ™ : REFLEX CES is able to propose equivalent component according to the customer needs
  • MTBF calculation
  • Analysis of the PCB’s components implementation (space, ranges, thermal brakes…) during the DFA process
  • Expertise on reflow soldering process, press-fit, reparability, RX, cleaning, coating
  • Producibility preliminary report
  • Economic risk assessment
  • Lead-time management
  • First Article Inspection (FAI) report

Keep me informed

If you want to know more about REFLEX CES, sign up for our newsletter to be updated on our initiatives, sectorial news and upcoming events.

Reflex CES Reflex CES