Achilles SoM
Achilles SoM

Product overview

The Arria® 10 SoC SOM is based on the Intel® Arria® 10 SoC FPGA, and is available in three different versions according to the FPGA, memory, and connectors needed (see the “Tech Spec” tab).

Featuring an ARM dual-core Cortex-A9 MPCore and up to 660 KLEs of advanced low-power FPGA logic elements, the Arria® 10 SoC combines the flexibility and ease of programming of a CPU with the configurability and parallel processing power of an FPGA.

Its small size and its strong FPGA makes it perfectly suited to embedded and industrial markets.

Thanks to a system-on-chip (SoC) (an integrated circuit inside the FPGA, most often a CPU (central processing unit) processor), the FPGA can better control the board.

The target markets include automotives, video broadcasting, machine and intelligent vision, industry, military, testing and measurements, and medical.

The Arria® 10 SoC SOM is shipped alone.

This System On Module is also available in a Development Kit : The Achilles DevKit. This Arria ® 10 SoC development kit will provide you with schematics, reference designs and a starter board.
We also offer a PCIe Carrier Board as an optional extra product compatible with all reflex ces Arria® 10 SoC SOMs, or we can design a custom carrier board.

Benefits & features

  • Intel® Arria® 10 SX 270 or 660 KLE
  • PCIe GEN3 x8
  • Dual ARM® Cortex™ A9
  • 228 SE IOs total (113 LVDS)
  • 24 transceivers up to @12Gbps
  • 2x DDR4 banks, 8GByte total
  • Commercial & Industrial Temp
  • Target markets : Bioscience, High Precision Measurement, Machine Automation, Radar Systems, Customizable

 

The Intel® Arria® 10 SoC family integrates a Dual-Core ARM Cortex-A9 MPCore, hardened floating-point variable-precision digital signal processing (DSP) blocks, along with high-speed transceivers and on-chip memory.

REFLEX CES’s Arria® 10 SoC SOM offers a range of interfaces according to your needs

Our Arria® 10 SoC SOM offers primary interfaces, such as several banks of DDR4 memory, I2C and USB links, FMC connectors (with many available LVDS/single ended I/Os), JTAG connectivity, CPU, peripherals, switches, ethernet interfaces. We also deliver all the relevant design rules for our boards, to develop the customer application carrier board (we can also develop it based on customer specifications). We provide online technical support and schematics, and several certifications may be available on request.

The Arria 10 SoC FPGA is a semiconductor that saves board space with integration, with twice the density of the previous generation. This leads to lower energy requirements and therefore lower power consumption. Our system-on-module is designed for productivity and is perfectly suited to embedded and industrial markets.

Our Arria ® 10 SoC som is specially designed for customer needs. Our sales team is available to advise you on the best solution according to your needs, at sales@reflexces.com.

 

Find out more on rocketboards:

  • Most current software BSP with complete build instructions for embedded Linux software components (u-boot, kernel, rootfs)
  • FPGA reference design
  • Full BSP available after board purchase (documentation and full suite of FPGA reference designs)

Diagrams

Block diagram of the Arria ® 10 SoC som:

Tech specs

Full specifications - Indus versions

v2/v5 version comparison below for information
Version v2 is End Of Life, please order only version v5

Features Description Achilles "Turbo" V2 Achilles "Indus" V2 Achilles "Indus" V5
NEW
Achilles "Indus" 12G V5
NEW
FPGA SoC Arria® 10 SoC, F34 package (1152 pins) 10AS066H2F34I1HG, speed grade -1
660KLE, 1688 DSP Blocks
Dual-Core ARM® Cortex®-A9 MPCore Processor
10AS066H2F34I1HG, speed grade -1
660KLE, 1688 DSP Blocks
Dual-Core ARM® Cortex®-A9 MPCore Processor
DDR4 Memory 32bit wide bank for FPGA 4GByte @2400MT/s 2GByte @2400MT/s 4GByte @2400MT/s
32bit wide bank for HPS 3GByte @2400MT/s 2GByte @2133MT/s 3GByte @2400MT/s
Communication & Networking 2x Gigabit Ethernet  RGMII on the HPS 2x Gigabit Ethernet  RGMII on the HPS
USB 3.0 using Cypress FX3 super speed controller USB 3.0 using Cypress FX3 super speed controller
USB 2.0 host/device OTG support connected to the HPS USB 2.0 host/device OTG support connected to the HPS
I²C link support connected to the HPS,EEPROM, Sensor Temp I²C link support connected to the HPS,EEPROM, Sensor Temp
UART connected to System controller and to HPS UART connected to System controller and to HPS
FMC Connectors Top Left
High Pint Count (HPC)
Power Suplies Output: +12/+3.3V/1.8V/ +VADJ = +1.8V Power Suplies Output: +12/+3.3V/1.8V/ +VADJ = +1.8V

X

80 LVDS pairs (1.25Gbps) or 160 single ended LVCMOS1.8V 80 LVDS pairs (1.25Gbps) or 160 single ended LVCMOS1.8V
10 Serial transceiver channels (RX and TX) @7Gbps 10 Serial transceiver channels (RX and TX) @7Gbps
Top Right
Low Pin Count (LPC)
Power Suplies Output: +12/+3.3V/1.8V/ +VADJ = +1.8V Power Suplies Output: +12/+3.3V/1.8V/ +VADJ = +1.8V

X

33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS1.8V 33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS1.8V
10 Serial transceiver channels (RX and TX) @7Gbps 10 Serial transceiver channels (RX and TX) @7Gbps
Bottom Left
High Pint Count (HPC)
No Power supply, respect +VADJ electrical standard (+1.8V) No Power supply, respect +VADJ electrical standard (+1.8V)
80 LVDS pairs (1.25Gbps) or 160 single ended LVCMOS 1.8V 80 LVDS pairs (1.25Gbps) or 160 single ended LVCMOS 1.8V
10 Serial transceiver channels (RX and TX) @7Gbps 10 Serial transceiver channels (RX and TX) @7Gbps 10 Serial transceiver channels (RX and TX) @12Gbps
Bottom Right
Low Pin Count (LPC)
Power Suply +12V
Hard Processing ARM peripheral I/Os (GbE,USB2.0,I²C,UART)
Power Suply +12V
Hard Processing ARM peripheral I/Os (GbE,USB2.0,I²C,UART)
33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS 1.8V
FPGA peripheral I/Os (GPIF II= USB3.0)
33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS 1.8V
FPGA peripheral I/Os (GPIF II= USB3.0)
4 Serial transceiver channels (RX and TX) @10Gbps
10 Serial transceiver channels (RX and TX) @7Gbps
4 Serial transceiver channels (RX and TX) @10Gbps
10 Serial transceiver channels (RX and TX) @7Gbps
14 Serial transceiver channels (RX and TX) @12Gbps
FPGA Configuration Onboard JTAG configuration circuitry to enable configuration over USB Onboard JTAG configuration circuitry to enable configuration over USB
512Mb Quad SPI Flash for remote upgrade and failsafe configuration 512Mb Quad SPI Flash for remote upgrade and failsafe configuration
Software Configuration Nand Flash eMMC (Store operating Linux system :  U boot, Kernel and RootFS) 32GByte 32GByte
Module dimensions 86mm x 95mm (3.4 x 3.8 inches) 83.1 x 95 mm (3.3 x 3.8 inches)
Weight Turbo/Indus module without Mechanics: 87.8g
Heat Spreader: 93.9g | Heat Sink: 86.9g | Fan: 15.7g
Indus/Indus 12G module without Mechanics: 87.8g
Heat Spreader: 93.9g | Heat Sink: 86.9g | Fan: 15.7g
Temperature range Commercial Industrial Industrial
Deliverables Arria® 10 SoC module (+ heat spreader, heat sink and fan) Arria® 10 SoC module (+ heat spreader, heat sink and fan)
Ordering Information RXCA10S066PF34-SOM00T RXCA10S066PF34-SOM01I RXCA10S066PF34-SOM02I RXCA10S066PF34-SOM12I

 

 

Full specifications - Lite versions

v2/v5 version comparison below for information
Version v2 is End Of Life, please order only version v5

Features Description Achilles "Lite" V2 Achilles "Lite" 12G V5
NEW
FPGA SoC Arria® 10 SoC, F34 package (1152 pins) 10AS027H3F34E2SG,  speed grade -2
270KLE, 830 DSP Blocks
Dual-Core ARM® Cortex®-A9 MPCore Processor
10AS027H3F34E2SG,  speed grade -2
270KLE, 830 DSP Blocks
Dual-Core ARM® Cortex®-A9 MPCore Processor
DDR4 Memory 32bit wide bank for FPGA 2GByte @2133MT/s 4GByte @2133MT/s
32bit wide bank for HPS 2GByte @2133MT/s 3GByte @2133MT/s
Communication & Networking 2x Gigabit Ethernet  RGMII on the HPS 2x Gigabit Ethernet  RGMII on the HPS
No USB 3.0 X
No USB 3.0 X
USB 2.0 host/device OTG support connected to the HPS USB 2.0 host/device OTG support connected to the HPS
I²C link support connected to the HPS,EEPROM, Sensor Temp I²C link support connected to the HPS,EEPROM, Sensor Temp
UART connected to System controller and to HPS UART connected to System controller and to HPS
FMC Connectors Top Left
High Pint Count (HPC)

X

X

Top Right
Low Pin Count (LPC)

X

X

Bottom Left
High Pint Count (HPC)
No Power supply, respect +VADJ electrical standard (+1.8V) No Power supply, respect +VADJ electrical standard (+1.8V)
34 LVDS pairs (1.25Gbps) or 68 single ended
LVCMOS 1.8V
34 LVDS pairs (1.25Gbps) or 68 single ended
LVCMOS 1.8V
10 Serial transceiver channels (RX and TX) @10Gbps 10 Serial transceiver channels (RX and TX) @12Gbps
Bottom Right
Low Pin Count (LPC)
Power Suply +12V
Hard Processing ARM peripheral I/Os (GbE,USB2.0,I²C,UART)
Power Suply +12V
Hard Processing ARM peripheral I/Os (GbE,USB2.0,I²C,UART)
33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS 1.8V
FPGA peripheral I/Os (GPIF II= USB3.0)
33 LVDS pairs (1.25Gbps) or 68 single ended LVCMOS 1.8V
FPGA peripheral I/Os (GPIF II= USB3.0)
14 Serial transceiver channels (RX and TX) @10Gbps 14 Serial transceiver channels (RX and TX) @12Gbps
FPGA Configuration Onboard JTAG configuration circuitry to enable configuration over USB Onboard JTAG configuration circuitry to enable configuration over USB
512Mb Quad SPI Flash for remote upgrade and failsafe configuration 512Mb Quad SPI Flash for remote upgrade and failsafe configuration
Software Configuration Nand Flash eMMC (Store operating Linux system :  U boot, Kernel and RootFS) 8GByte 32GByte
Module dimensions 86mm x 95mm (3.4 x 3.8 inches) 83.1 x 95 mm (3.3 x 3.8 inches)
Weight Lite module without Mechanics: 78.8g
Heat Spreader: 93.9g | Heat Sink: 86.9g | Fan: 15.7g
Lite 12G module without Mechanics: 78.8g
Heat Spreader: 93.9g | Heat Sink: 86.9g | Fan: 15.7g
Temperature range Commercial Commercial
Deliverables Arria® 10 SoC module (+ heat spreader, heat sink and fan) Arria® 10 SoC module (+ heat spreader, heat sink and fan)
Ordering Information RXCA10S027PF34-SOM00L RXCA10S027PF34-SOM12L

Videos

Arria® 10 SoC disruptive System-on-Module by REFLEX CES :

Achilles Workshop by REFLEX CES :

Object detection demo using FPGA DNN IP :

 

Below are the videos regarding The Achilles DevKit :

Setting up your REFLEX CES Achilles Development Kit :

Exploration of REFLEX CES' Graphical User Interface (GUI) for the Achilles Development Kit :

Deliverables

Deliverables

 

  • Arria® 10 SoC module (+ heat spreader, heat sink and fan)

 

The following deliverables are only included with the purchase of an Arria® 10 SoC SoM Instant-DevKit:

  • Module, Starter board, PCIe carrier board documentation (Reference Manual, Starter Guide)
  • Starter board & PCIe carrier board schematics
  • Carrier Design Guide
  • Mechanical drawings PDF, 3D Step, Assembly files PDF
  • HDL Test Designs
    • Built with Intel® Quartus® Prime Pro Version 21.3
  •  FPGA HPS Software
    • Includes U-Boot bootloader (v2021.07) and Linux kernel (v5.10) to run an embedded Linux OS on the FPGA HPS
    • Built with Yocto Project version 4.0 (Kirkstone)
  • Software design accessible online on rocketboards
  • Online support at support.reflexces.com

Export control ECCN

ECCN Number : 4A994i
CECC (commodity Export Classification Certificate) : Download certificate

Applications

JESD204B demonstration

FPGA resources (HPS included)

  • ALM: 28k (11%)
  • Reg: 48k (10%)
  • LUT: 31k
  • M20K: 608 (29%)
  • DSP: 16 (1%)
  • IOPLL: 5 (45%)
  • HSSI (TX + RX): 4 + 4

ADC, DAC and JESD204B setup

  • DAC:
    • 4 lanes @5Gbps
    • Fsample: 500MHz
  • ADC:
    • 4 lanes @5Gbps
    • Fsample: 500MHz

Power*

  • Complete setup: 28W
  • FPGA (est.**): 8W

* Including FAN: 1.3W
** Quartus Power Estimator

 

  • JESD204B BSP on request

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