


Presentation of the Zeus Zynq UltraScale+ module
The Zeus Zynq® UltraScale+™ MPSoC is a system-on-module, based on the AMD ZU11EG/ZU19EG Zynq® UltraScale+™ MPSoC FPGA.
With an innovative ARM® + FPGA architecture, the Zynq® Ultrascale+™ FPGA is smarter and optimized for differentiation, analytics and control. Its large portfolio of SW and HW design tools and reference designs enables you to easily develop any project. The MPSoC UltraScale+™ FPGA provides multiprocessing capabilities, because the MPSoC (microprocessor system-on-chip) is an SoC that includes multiple microprocessors. MPSoCs usually target embedded applications.
Target markets of this Zynq® UltraScale+™ module include software defined radio, radar systems, electronic warfare, high-precision measurement, and much more.
The Zeus Zynq® UltraScale+™ module is fully compatible with the carrier board : Zeus Zynq® UltraScale+™ board.
The Zynq® UltraScale+™ MPSoC family is based on AMD UltraScale™ MPSoC architecture. This family of products integrates a 64-bit quad-core A53 and dual-core ARM Cortex-R5 processing system (PS) and AMD programmable logic (PL) UltraScale architecture in a single device.
The Zynq® Ultrascale+™ MPsoC FPGA was chosen for its unmatched performance, as well as its lower system power architecture.
REFLEX CES included numerous essential components for an embedded board, developed for this FPGA: DDR4 memories, connectors, BMC, etc., and a customized software environment.
Our Zynq® UltraScale+™ module is specially designed for customer needs. Our sales team is available to advise you on the best solution according to your needs, at sales@reflexces.com
Features | Zeus Zynq® UltraScale+™ MPSoC | |
FPGA SoC | FPGA speed grade 1, Industrial Temp Range Quad-core ARM Cortex-A53 MPCore @1.2GHz Dual-core ARM Cortex-R5 MPCore @500MHz Mali™-400 MP2 @600MHzZeus Indus ZU11EG : XCZU11EG-1FFVC1760I device Programmable Logic 653 KLC Total Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices Zeus Indus ZU19EG : XCZU19EG-1FFVC1760I device Programmable Logic 1143 KLC Total Block RAM 34.6MB, UltraRAM 36.0Mb, 1968 DSP Slices |
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DDR4 Memory | PL= 2 banks 4GByte each @2400MT/s, x32bit | |
PS= 1 bank 8GByte @2400 MT/s, x64bit + x8bit ECC | ||
PS Communication & Networking | 10/100/1000 Base-T Ethernet RGMII 43x MIO configurable for interface like: NAND flash, eMMC or SD card, ETH RGMII, USB, SPI, I2C, UART, GPIO |
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Top Connectors | High Speed Accelerate connectors (GTY) | 4x 4 serial transceivers channel (RX and TX) @25.78Gbps (Existing cable adapter to QSFP+ and SFP+ connectors) |
Bottom Connectors | Processor (PS) Mezzanine connector | 4x serial transceivers channel (RX and TX) @6Gbps PCIe Gen2 x4 Root Complex capable 43x MIO |
GTH Mezzanine connector | 32x serial transceivers channel (RX and TX) @12.5Gbps PCIe Gen3 x16 End Point capable |
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HP Mezzanine connectors | 208x HP I/O high speed up to 1260 Mb/s, designed for high speed chip-to-chip interfaces with voltages up to 1.8V 96x LVDS capability |
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HD Mezzanine connector | 96x HD I/O low speed up to 250 Mb/s, designed to support low speed interfaces with voltages 3.3V, 2.5V, 1.8V, 1.2V | |
FPGA Configuration |
JTAG available on Processor (PS) Mezzanine connector | |
Quad SPI 1Gbit NOR Flash for non-volatile storage, remote upgrade and failsafe configuration |
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Software Configuration | 128GByte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS) | |
Mechanical & Environmental Specification | Module rugged for shocks and high vibration IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission), EN60068 (Vibration: sinusoidal, 10Hz - 2KHz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g) 5-15V Power Input Industrial temperature grade -40°C to +85°C Conformal coating (option on request) |
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Power & Dissipation | Zeus Indus ZU11EG : 70W max, active heatsink (heat spreader + heatsink + fan) Zeus Indus ZU19EG : under definition |
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Board Management Controller | Communication with Carrier board: I2C, UART, SMBus Communication with FPGA : 1x UART to PL, 1x UART to PS Monitoring : Current, voltages, temperature, ID information Programming : Clock, QSPI FPGA, QSPI BMC Control: Power, temperature protection, Fans |
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Module dimensions | 107mm x 85mm (4 x 3.4 inches) / 12mm thickness (38.6mm with active heatsink and heat spreader) | |
Deliverables | • Zeus Zynq® UltraScale+™ MPSoC module • Active heatsink with heat spreader • Power supply and cables (US, UK, EU, JP), micro-USB cable • Board Support Package (to download from our online technical support): • Starter Guide, Module and carrier board Reference Manuals • HDL Test Designs by interface (Vivado 2020.2 version) • 100G Ethernet MAC HDL test design • Linux Kernel & Linaro optimized distribution, U-boot bootloader, Test scripts • Mechanical drawings, assembly files • Interconnect pinout file • Carrier board schematics, Carrier board Design Guide • On request: 3D step files on the module and its carrier board, • Carrier board gerber files, carrier board BOM & PCB specification, S-parameters • 1-year technical support • 1-year warrantee • Online support at support.reflexces.com |
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Ordering Information | Zeus Indus ZU11EG : RXCZUP11EGPF42-SOM01I Zeus Indus ZU19EG: RXCZUP19EGPF42-SOM01I – available July 2023 |
Zeus Zynq® UltraScale+™ MPSoC System-on-Module from REFLEX CES:
UNBOXING your REFLEX CES Zeus Zynq® UltraScale+™ MPSoC System-on-Module:
Deliverables for the purchase of a System-on-Module:
Ordering information
Zeus Indus ZU11EG : RXCZUP11EGPF42-SOM01I
Zeus Indus ZU19EG: RXCZUP19EGPF42-SOM01I – available July 2023
The Zeus Zynq UltraScale+ board is sold separately
Ordering information : RXCZUP-CBD0SA
The following deliverables are only included with the purchase of a Zynq UltraScale+ carrier board :
1/ Zeus Zynq® UltraScale+™ carrier board
The following deliverables are only included with the purchase of a carrier board :
2/ Zeus GTY-QSFP28 eval board
Connectors
Misc: 1x E2PROM
FMC dimensions: 69mm x 72.3mm
3/ Zeus GTY-QSFP28 Cable
ECCN Number : 3A991
CECC (commodity Export Classification Certificate) : Download certificate