The Zeus Zynq® UltraScale+™ MPSoC is a System-on-Module, based on the Xilinx® ZU11EG Zynq® UltraScale+™ MPSoC FPGA.
With an Innovative ARM® + FPGA architecture, the Zynq® Ultrascale+™ FPGA is smarter and optimized for differentiation, analytics & control. Its largest portfolio of SW & HW design tools and reference designs allows you to easily develop any of your project. Also, having an MPSoC UltraScale+™ FPGA allows you to have multiprocessing capabilities, as the MPSoC (microprocessor system-on-chip) is an SoC including multiple microprocessors. MPSoCs is usually targeted for embedded applications.
Target markets of this Zynq® UltraScale+™ module include Software Defined Radio, Radar Systems, Electronic Warfare, High Precision Measurement, and much more.
The Zeus Zynq® UltraScale+™ module is fully compatible with the Carrier Board : Zeus Zynq® UltraScale+™ board.
The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This family of products integrates a 64-bit quad-core A53 and dual-core ARM Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device.
The Zynq® Ultrascale+™ MPsoC FPGA has been chosen for its ever-unmatched performances, as well as for its lower system power architecture.
REFLEX CES included and developed around this FPGA numerous essential components for an embedded board: DDR4 memories, connectors, BMC, etc, and a customized software environment.
Our Zynq® UltraScale+™ module is specially designed for our customers' needs. Our sales team is available to advise you on the better solution, according to your needs, at sales@reflexces.com
Block diagram of the Zynq UltraScale+ module:
| Features | Zeus Zynq® UltraScale+™ MPSoC | |
| FPGA SoC | XCZU11EG-1FFVC1760I device Programmable Logic 650 KLC, Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices FPGA speed grade 1, Industrial Temp Range Quad-core ARM Cortex-A53 MPCore @1.2GHz Dual-core ARM Cortex-R5 MPCore @500MHz Mali™-400 MP2 @600MHz |
|
| DDR4 Memory | PL= 2 banks 4GByte each @2400MT/s, x32bit | |
| PS= 1 bank 8GByte @2400 MT/s, x64bit + x8bit ECC | ||
| PS Communication & Networking | 10/100/1000 Base-T Ethernet RGMII 43x MIO (NAND flash, eMMC or SD card, ETH RGMII, USB, SPI, I2C, UART, GPIO) |
|
| Top Connectors | High Speed Accelerate connectors (GTY) | 4x 4 serial transceivers channel (RX and TX) @25.78Gbps (Existing cable adapter to QSFP+ and SFP+ connectors) |
| Bottom Connectors | Processor (PS) Mezzanine connector | 4x serial transceivers channel (RX and TX) @6Gbps PCIe Gen2 x4 Root Complex capable 43x MIO |
| GTH Mezzanine connector | 32x serial transceivers channel (RX and TX) @12.5Gbps PCIe Gen3 x16 End Point capable 96x LVDS capability |
|
| HP Mezzanine connectors | 208x HP I/O high speed up to 1260 Mb/s, designed for high speed chip-to-chip interfaces with voltages up to 1.8V | |
| HD Mezzanine connector | 96x HD I/O low speed up to 250 Mb/s, designed to support low speed interfaces with voltages 3.3V, 2.5V, 1.8V, 1.2V | |
| FPGA Configuration |
JTAG available on Processor (PS) Mezzanine connector | |
| Quad SPI 2x1Gbit NOR Flash for non-volatile storage, remote upgrade and failsafe configuration |
||
| Software Configuration | 128GByte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS) | |
| Mechanical & Environmental Specification | Module rugged for shocks and high vibration IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission), EN60068 (Vibration: sinusoidal, 10Hz - 4000Hz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g) 5-15V Power Input Industrial temperature grade -40°C to +85°C Conformal coating (option on request) Free of ITAR control |
|
| Power & Dissipation | 70W max, active heatsink (heat spreader + heatsink + fan) | |
| Board Management Controller | Communication with Carrier board: I2C, UART, SMBus Communication with FPGA : 1x UART to PL, 1x UART to PS Monitoring : Current, voltages, temperature, ID information Programming : Clock, QSPI FPGA, QSPI BMC Control: Power, temperature protection, Fans |
|
| Module dimensions | 107mm x 85mm (4 x 3.4 inches) / 12mm thickness (38.6mm with active heatsink and heat spreader) | |
| Deliverables | Zeus Zynq® UltraScale+™ MPSoC module Active heatsink with heat spreader |
|
| Ordering Information | RXCZUP11EGPF42-SOM01I | |
Zeus Zynq® UltraScale+™ MPSoC System-on-Module from REFLEX CES:
Deliverables for the purchase of a System-on-Module:
Ordering information: RXCZUP11EGPF42-SOM01I
The Zeus Zynq UltraScale+ board is sold separately
Ordering information : RXCZUP-CBD0SA
The following deliverables are only included with the purchase of a Zynq UltraScale+ carrier board :
