Zeus Zynq® UltraScale+™ MPSoC System-on-Module

Presentation of the Zeus Zynq UltraScale+ module

Product overview

The Zeus Zynq® UltraScale+™ MPSoC is a System-on-Module, based on the Xilinx® ZU11EG Zynq® UltraScale+™ MPSoC FPGA.

With an Innovative ARM® + FPGA architecture, the Zynq® Ultrascale+™ FPGA is smarter and optimized for differentiation, analytics & control. Its largest portfolio of SW & HW design tools and reference designs allows you to easily develop any of your project. Also, having an MPSoC UltraScale+™ FPGA allows you to have multiprocessing capabilities, as the MPSoC (microprocessor system-on-chip) is an SoC including multiple microprocessors. MPSoCs is usually targeted for embedded applications.

Target markets of this Zynq® UltraScale+™ module include Software Defined Radio, Radar Systems, Electronic Warfare, High Precision Measurement, and much more.

The Zeus Zynq® UltraScale+™ module is fully compatible with the Carrier Board : Zeus Zynq® UltraScale+™ board.


Please contact us directly if none are available on

Benefits & features

  • Zynq® UltraScale+™ MPSoC ZU11EG
  • PCIe Gen2 x4 Root Complex
  • PCIe Gen3 x16 End Point
  • Quad-Core ARM Cortex-A53
  • 304 SE IOs total (96 LVDS)
  • 16 GTY @25.78Gbps (Top side)
  • 32 GTH @12.5Gbps (Bot side)
  • 3x DDR4 banks, 16GByte Total
  • Industrial Temp Grade
  • Long Term Supply
  • Designed for High Precision Measurement, Artifical Intelligence, Radar Systems, Software Defined Radio and "Customizable" markets


The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This family of products integrates a 64-bit quad-core A53 and dual-core ARM Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device.

The Zynq® Ultrascale+™ MPsoC FPGA has been chosen for its ever-unmatched performances, as well as for its lower system power architecture.

REFLEX CES included and developed around this FPGA numerous essential components for an embedded board: DDR4 memories, connectors, BMC, etc, and a customized software environment.

Our Zynq® UltraScale+™ module is specially designed for our customers' needs. Our sales team is available to advise you on the better solution, according to your needs, at


Block diagram of the Zynq UltraScale+ module:

Tech spec

Features Zeus Zynq® UltraScale+™ MPSoC
FPGA SoC XCZU11EG-1FFVC1760I device
Programmable Logic 650 KLC,
Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices
FPGA speed grade 1, Industrial Temp Range
Quad-core ARM Cortex-A53 MPCore @1.2GHz
Dual-core ARM Cortex-R5 MPCore @500MHz
Mali™-400 MP2 @600MHz
DDR4 Memory PL= 2 banks 4GByte each @2400MT/s, x32bit
PS= 1 bank 8GByte @2400 MT/s, x64bit + x8bit ECC
PS Communication & Networking 10/100/1000 Base-T Ethernet RGMII
43x MIO configurable for interface like: NAND flash, eMMC or SD card, ETH RGMII, USB, SPI, I2C, UART, GPIO
Top Connectors High Speed Accelerate connectors (GTY) 4x 4 serial transceivers channel (RX and TX) @25.78Gbps
(Existing cable adapter to QSFP+ and SFP+ connectors)
Bottom Connectors Processor (PS) Mezzanine connector 4x serial transceivers channel (RX and TX) @6Gbps
PCIe Gen2 x4 Root Complex capable
43x MIO
GTH Mezzanine connector 32x serial transceivers channel (RX and TX) @12.5Gbps
PCIe Gen3 x16 End Point capable
HP Mezzanine connectors 208x HP I/O high speed up to 1260 Mb/s, designed for high speed chip-to-chip interfaces with voltages up to 1.8V
96x LVDS capability
HD Mezzanine connector 96x HD I/O low speed up to 250 Mb/s, designed to support low speed interfaces with voltages 3.3V, 2.5V, 1.8V, 1.2V
JTAG available on Processor (PS) Mezzanine connector
Quad SPI
1Gbit NOR Flash for non-volatile storage, remote upgrade and failsafe configuration
Software Configuration 128GByte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS)
Mechanical & Environmental Specification Module rugged for shocks and high vibration
IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission),
EN60068 (Vibration: sinusoidal, 10Hz - 150Hz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g)
5-15V Power Input
Industrial temperature grade -40°C to +85°C
Conformal coating (option on request)
Power & Dissipation 70W max, active heatsink (heat spreader + heatsink + fan)
Board Management Controller Communication with Carrier board: I2C, UART, SMBus
Communication with FPGA : 1x UART to PL, 1x UART to PS
Monitoring : Current, voltages, temperature, ID information
Programming : Clock, QSPI FPGA, QSPI BMC
Control: Power, temperature protection, Fans
Module dimensions 107mm x 85mm (4 x 3.4 inches) / 12mm thickness (38.6mm with active heatsink and heat spreader)
Deliverables Zeus Zynq® UltraScale+™ MPSoC module
Active heatsink with heat spreader
Ordering Information RXCZUP11EGPF42-SOM01I


Zeus Zynq® UltraScale+™ MPSoC System-on-Module from REFLEX CES:


Deliverables for the purchase of a System-on-Module:

  • Zeus Zynq® UltraScale+™ MPSoC module
  • Active heatsink with heat spreader


Ordering information: RXCZUP11EGPF42-SOM01I


The Zeus Zynq UltraScale+ board is sold separately

Ordering information : RXCZUP-CBD0SA

The following deliverables are only included with the purchase of a Zynq UltraScale+ carrier board :

  • Power supply and cables (US, UK, EU, JP), micro-USB cable
  • Board Support Package (to download from our online technical support):
    • Starter Guide, Module and carrier board Reference Manuals
    • HDL Test Designs by interface (Vivado 2020.2 version)
    • Linux Kernel & Linaro optimized distribution, U-boot bootloader, Test scripts
    • Mechanical drawings, assembly files
    • Interconnect pinout file
    • Carrier board schematics, Carrier board Design Guide
    • On request: 3D step files on the module and its carrier board, Carrier board gerber files, carrier board BOM & PCB specification, S-parameters
  • 1-year technical support
  • 1-year warrantee
  • Online support at

Keep me informed

If you want to know more about REFLEX CES, sign up for our newsletter to be updated on our initiatives, sectorial news and upcoming events.

Reflex CES Reflex CES