Features |
Zeus Zynq® UltraScale+™ MPSoC |
FPGA SoC |
XCZU11EG-1FFVC1760I device
Programmable Logic 650 KLC,
Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices
FPGA speed grade 1, Industrial Temp Range
Quad-core ARM Cortex-A53 MPCore @1.2GHz
Dual-core ARM Cortex-R5 MPCore @500MHz
Mali™-400 MP2 @600MHz |
DDR4 Memory |
PL= 2 banks 4GByte each @2400MT/s, x32bit |
PS= 1 bank 8GByte @2400 MT/s, x64bit + x8bit ECC |
PS Communication & Networking |
10/100/1000 Base-T Ethernet RGMII
43x MIO configurable for interface like: NAND flash, eMMC or SD card, ETH RGMII, USB, SPI, I2C, UART, GPIO |
Top Connectors |
High Speed Accelerate connectors (GTY) |
4x 4 serial transceivers channel (RX and TX) @25.78Gbps
(Existing cable adapter to QSFP+ and SFP+ connectors) |
Bottom Connectors |
Processor (PS) Mezzanine connector |
4x serial transceivers channel (RX and TX) @6Gbps
PCIe Gen2 x4 Root Complex capable
43x MIO |
GTH Mezzanine connector |
32x serial transceivers channel (RX and TX) @12.5Gbps
PCIe Gen3 x16 End Point capable |
HP Mezzanine connectors |
208x HP I/O high speed up to 1260 Mb/s, designed for high speed chip-to-chip interfaces with voltages up to 1.8V
96x LVDS capability |
HD Mezzanine connector |
96x HD I/O low speed up to 250 Mb/s, designed to support low speed interfaces with voltages 3.3V, 2.5V, 1.8V, 1.2V |
FPGA
Configuration |
JTAG available on Processor (PS) Mezzanine connector |
Quad SPI
1Gbit NOR Flash for non-volatile storage, remote upgrade and failsafe configuration |
Software Configuration |
128GByte NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS) |
Mechanical & Environmental Specification |
Module rugged for shocks and high vibration
IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission),
EN60068 (Vibration: sinusoidal, 10Hz - 2KHz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g)
5-15V Power Input
Industrial temperature grade -40°C to +85°C
Conformal coating (option on request) |
Power & Dissipation |
70W max, active heatsink (heat spreader + heatsink + fan) |
Board Management Controller |
Communication with Carrier board: I2C, UART, SMBus
Communication with FPGA : 1x UART to PL, 1x UART to PS
Monitoring : Current, voltages, temperature, ID information
Programming : Clock, QSPI FPGA, QSPI BMC
Control: Power, temperature protection, Fans |
Module dimensions |
107mm x 85mm (4 x 3.4 inches) / 12mm thickness (38.6mm with active heatsink and heat spreader) |
Deliverables |
Zeus Zynq® UltraScale+™ MPSoC module
Active heatsink with heat spreader |
Ordering Information |
RXCZUP11EGPF42-SOM01I |