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Zeus Zynq® UltraScale+™ MPSoC System-on-Module

Presentation of the Zeus Zynq UltraScale+ module

Product overview

The Zeus Zynq® UltraScale+™ MPSoC is a System-on-Module, based on the Xilinx® ZU11EG Zynq® UltraScale+™ MPSoC FPGA.

With an Innovative ARM® + FPGA architecture, the Zynq® Ultrascale+™ FPGA is smarter and optimized for differentiation, analytics & control. Its largest portfolio of SW & HW design tools and reference designs allows you to easily develop any of your project. Also, having an MPSoC UltraScale+™ FPGA allows you to have multiprocessing capabilities, as the MPSoC (microprocessor system-on-chip) is an SoC including multiple microprocessors. MPSoCs is usually targeted for embedded applications.

Target markets of this Zynq® UltraScale+™ module include High Precision Measurement, Artificial Intelligence, Radar Systems, Software Defined Radio, and much more.

The Zeus Zynq® UltraScale+™ module is fully compatible with the Carrier Board : Zeus Zynq® UltraScale+™ board.

Benefits & features

  • Zynq® UltraScale+™ MPSoC ZU11EG
  • PCIe Gen2 x4 Root Complex
  • PCIe Gen3 x16 End Point
  • Quad-Core ARM Cortex-A53
  • 304 SE IOs total (104 LVDS)
  • 16 GTY @25.78Gbps (Top side)
  • 32 GTH @12.5Gbps (Bot side)
  • 3x DDR4 banks, 16GBytes Total
  • Industrial Temp Grade
  • Long Term Supply
  • Designed for High Precision Measurement, Artifical Intelligence, Radar Systems, Software Defined Radio and "Customizable" markets

 

The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This family of products integrates a 64-bit quad-core A53 and dual-core ARM Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale architecture in a single device.

The Zynq® Ultrascale+™ MPsoC FPGA has been chosen for its ever-unmatched performances, as well as for its lower system power architecture.

REFLEX CES included and developed around this FPGA numerous essential components for an embedded board: DDR4 memories, connectors, BMC, etc, and a customized software environment.

Our Zynq® UltraScale+™ module is specially designed for our customers' needs. Our sales team is available to advise you on the better solution, according to your needs, at sales@reflexces.com

Diagrams

Block diagram of the Zynq UltraScale+ module:

Tech spec

Features Zeus Zynq® UltraScale+™ MPSoC
FPGA SoC XCZU11EG-1FFVC1760I device
Programmable Logic 650 KLC,
Block RAM 21.1MB, UltraRAM 22.5Mb, 2928 DSP Slices
FPGA speed grade 1, Industrial Temp Range
Quad-core ARM Cortex-A53 MPCore @1.2GHz
Dual-core ARM Cortex-R5 MPCore @500MHz
Mali™-400 MP2 @600MHz
DDR4 Memory PL= 2 banks 4GB each @2400MT/s, x32bit
PS= 1 bank 8GB @2400 MT/s, x64bit + x8bit ECC
PS Communication & Networking 10/100/1000 Base-T Ethernet RGMII
43x MIO (NAND flash, eMMC or SD card, ETH RGMII, USB, SPI, I2C, UART, GPIO)
Top Connectors High Speed Accelerate connectors (GTY) 4x 4 serial transceivers channel (RX and TX) @25.78Gbps
(Existing cable adapter to QSFP+ and SFP+ connectors)
Bottom Connectors Processor (PS) Mezzanine connector 4x serial transceivers channel (RX and TX) @6Gbps
PCIe Gen2 x4 Root Complex capable
43x MIO
GTH Mezzanine connector 32x serial transceivers channel (RX and TX) @12.5Gbps
PCIe Gen3 x16 End Point capable
HP Mezzanine connectors 208x HP I/O high speed up to 1260 Mb/s, designed for high speed chip-to-chip interfaces with voltages up to 1.8V
HD Mezzanine connector 96x HD I/O low speed up to 250 Mb/s, designed to support low speed interfaces with voltages 3.3V, 2.5V, 1.8V, 1.2V
FPGA
Configuration
JTAG available on Processor (PS) Mezzanine connector
Quad SPI
2x1Gb NOR Flash for non-volatile storage, remote upgrade and failsafe configuration
Software Configuration 128GB NAND Flash eMMC (Stores U-Boot, Linux Kernel, and RootFS)
Mechanical & Environmental Specification Module rugged for shocks and high vibration
IEC/EN61000 (EMI immunity), EN61000 + EN55032 (EMI emission),
EN60068 (Vibration: sinusoidal, 10Hz - 4000Hz, +/- 0.15mm, 2g ; Shock: half-sinusoidal, 11ms, 15g)
5-15V Power Input
Industrial temperature grade -40°C to +85°C
Conformal coating (option on request)
Free of ITAR control
Power & Dissipation 70W max, active heatsink
Board Management Controller Communication with Carrier board: I2C, UART, SMBus
Communication with FPGA : 1x UART to PL, 1x UART to PS
Monitoring : Current, voltages, temperature, ID information
Programming : Clock, QSPI FPGA, QSPI BMC
Control: Power, temperature protection, Fans
Module dimensions 107mm x 85mm (4 x 3.4 inches) / 12mm thickness (38.6mm with active heatsink and heat spreader)
Deliverables Zeus Zynq® UltraScale+™ MPSoC module
Active heatsink with heat spreader
Ordering Information RXCZUP11EGPF42-SOM01I

Deliverables

Deliverables for the purchase of a System-on-Module:

  • Zeus Zynq® UltraScale+™ MPSoC module
  • Active heatsink

 

Ordering information: RXCZUP11EGPF42-SOM01I

 

The Zeus Zynq UltraScale+ board is sold separately

Ordering information : RXCZUP-CBD0SA

The following deliverables are only included with the purchase of a Zynq UltraScale+ carrier board :

  • PDF Documentation (Starter Guide, Reference Manual, Interconnect pinout file)
  • Power supply and cables (US, UK, EU, JP), interface cables (USB, Ethernet)
  • Test designs (Vivado II project)
  • Linux Kernel & Linaro optimized distribution, U-boot bootloader, Test scripts
  • Mechanical drawings, 3D step, assembly files
  • Carrier board schematics
  • Carrier board Design Guide
  • Online support at support.reflexces.com

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